От: D&R SoC NewsAlert [SoC-NewsAlert@design-reuse.com]
Отправлено: 14 сентября 2004 г. 12:50
Кому: Michael Dolinsky
Тема: D&R SoC News Alert - September 14, 2004
DR SoC News Alert
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September 14, 2004    


Welcome to issue of September 14, 2004 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

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Complete, self-contained Host Controller Interface (HCI) Bluetooth embedded solution from IPextreme
Large Math Core for RSA and Diffie-Hellman from Elliptic Semiconductor
High Frequency Crystal Oscillator on UMC 0.15um (L150-ASIC) from Virtual Silicon
Extended resolution WLAN baseband AFE (802.11abg) with PLL from ChipIdea Microelectronics
Digital IF Core for Spectrum Anlaysers from RF Engines
Ultra Wide Band Analog Front End from Cadence Design Systems
Wanted IPs :
  • 16-bit Audio CODEC
    • Platform FPGAs enter SoC land
    Trade-offs in high-performance comms
    FPGA-to-ASIC conversion a crucial concern
    Flash-based FPGAs serve point-of-sale apps
    Platform ASICs stake the middle ground
    Structured ASICs take FPGA prototypes into volume production
    New Wave of FPGA Prototyping for System-on-Chip Designs
    Tunneling SPI-4.2 Through an Advanced Switching Fabric
    Optimizing for PowerPC on embedded Linux
    Consumer Electronics Market Requires IP-Rich Custom SoCs for Hardware Differentiation
    ESL tools: Are EDA giants in the game?
    IP/SOC PRODUCTS
    Xignal Technologies introduces 10Gb/s-CMOS XFI transceiver design with smallest footprint in industry
    CEVA Launches CEVA-X System On Chip Platforms For Wireless, Consumer And Multimedia Markets
    IPextreme Bluetooth Core Lowers Power Consumption up to 50% for High Volume Mobile Applications
    SIDSA announces DVB-H chip and intellectual property for digital television for mobile telephones
    nSys Announces the Release of AS nVS, a Verification Solution for Advanced Switching in Verilog
    SafeNet Announces First Intrusion Prevention IP for Network Semiconductor Market
    MoSys' 1T-SRAM Memory Silicon-Verified on DongbuAnam's 0.18-Micron Standard Logic Process; 0.13-Micron Verifications Initiated
    Altera and Modelware to Launch Advanced Switching Solution at Intel Developer Forum
    Toshiba, NEC Electronics, and Fujitsu Agree On "COSMORAM Rev.3" Common Specifications For PSRAM
    STRUCTURED ASIC
    TriCN Interfaces Provide High-Performance and Flexibility for Leopard Logic's Gladiator CLD6400
    Faraday Unveils Highest Performance NPU with ASIC Programmability at Very Low Cost
    LSI Logic Advances High Speed Serial Interconnect with New RapidChip Platform ASIC Family
    DEALS
    Cypress Semiconductor Licenses Astro Semiconductor's PCI Express PHY Technology
    Wipro's 1394 AV Link IP to help MediaTek Reinforce Market Leadership in the Consumer Electronic Space
    PMC-Sierra Broadens MIPS-Based CPU Offering with Newest 32-Bit Synthesizeable Core Families from MIPS Technologies
    Read Channel License Agreement with Hitachi Enables Infineon to Offer Advanced Silicon Chip Solutions for Hard Disk Drives
    Ricoh Will Use Sarnoff TakeCharge Design Approach In Analog CMOS Process Families
    Cascade IP licenses its PCI Express Design IP to Sun Microsystems
    BUSINESS
    Silicon Storage Technology strengthens its embedded flash business with acquisition of Emosyn
    New Fabless Semiconductor Company, Ambric, Inc., Receives $10.4 Million In Series A Funding
    AMIS Holdings Signs Agreement to Acquire Dspfactory Ltd to Strengthen DSP Design Capabilities for Medical and Industrial Markets
    NewLogic sees growth in market for integration of Bluetooth in System on Chip (SoC) devices
    ARM Opens Beijing Office To Support Strong Regional Growth
    ZRRT Collaborates With ARM To Integrate JTEK Technology in China Unicom's Next-Generation Java Environment
    FINANCIAL RESULTS
    Actel Corporation Announces Third Quarter Business Update
    LEGAL
    Agilent receives patent on USB test spec
    PEOPLE
    Faraday Continues International Expansion, Names Chung Ho as Vice President of Field Market Development
    DESIGN SERVICES
    CEVA Speeds Customer's Time To Silicon With The Launch Of CEVA Services
    EMBEDDED SYSTEMS
    Densitron Commences Shipping of Single Board Computer Which Is First Embedded Application To Include Atmel's Trusted Platform Module (TPM)
    Cavium Networks Standardizes Upon the MIPS Architecture and Announces cnMIPS Core for Secure Network Services
    Marvell Announces New System On Chip Optimized For Small Form Factor Hard Disk Storage In Consumer Electronics
    NEC Electronics Announces New High Performance MPEG Decoder for Integrated Digital Televisions, Supporting Digital and Digitised Analogue Signals
    CoreTek And Hopen Collaborate With ARM To Develop Support For JTEK And Swerve Technology
    Sun Microsystems and ARM To Deliver High-Performance, Pre-Integrated Java Solutions For Mobile Devices
    FOUNDRIES
    TSMC August Sales Set Record High
    Chartered Launches 0.13-Micron, 0.11-Micron and 90-Nanometer Processes at 300-mm Fab
    SMIC Extends ARM Foundry Program Relationship To ARM926EJ Processor In 0.13-Micron Process
    FPGA/CPLD
    Xilinx Ramps Virtex-4 Shipments, Delivers Breakthrough Performance At The Lowest Cost
    Xilinx Ships ISE 6.3i Design Suite, Widens Performance Lead Up To 40% With Virtex-4 FPGAs
    Lattice Semiconductor to Make Advance Payment to Support Fujitsu's New 300mm Fab
    Altera to Demonstrate Industry's First Complete FPGA-Based DVB-ASI Solution at IBC 2004
    Xilinx And Sandia National Labs Team To Drive Reconfigurable Logic Technology Into Space
    New Release of Altera's DSP Builder Accelerates Stratix II and Cyclone II FPGA-Based DSP Designs
    Altera and Industry-Leading Memory Vendors Deliver 533-Mbps DDR2 SDRAM Solution for Stratix II FPGAs
    EDA
    MIPS Technologies and Magma Announce Reference Methodology for High-Performance 24K Core Family
    SiWorks Standardizes on Blast Create, Delivers "Magma-Ready" Semiconductor IP Solutions for Leading-Edge Wireless Applications
    OTHER
    Design & Reuse provides comprehensive portal to LSI Logic CoreWare IP for RapidChip Platform ASIC and Cell-Based ASIC Designs
    Denali Joins Newly Formed Serial ATA Group
    Rambus to Showcase World's First Demonstration of XDR Memory Module Technology

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